Wayon Electronics Ltd. and its distribution partner TRS-STAR are introducing their new high current Trench Mosfet family in the TO-LL package. Compared with reference designs using standard TO-263/D2PAK solutions this package is offering a 30% footprint reduction and a height reduction by 50% (package dimensions 9.9 x 11.7 x 2.3mm). This makes a solution with a Wayon TO-LL package perfectly suited for designs requesting high current capability together with a very compact form factor.
The sophisticated package concept is offering a creepage distance of 2.7mm for additional design safety and a separate signal-source pin to ensure reliable switching at high frequencies.
The Wayon TO-LL product family is starting with a low voltage range from 20V/0.85mΩtyp reaching with steps from medium voltage up to 200V/8mΩtyp including some special types with super current capability of up to 300A with a RDS(on) well below 1mΩ
The device performance is targeting application like high power tools, battery management systems, DC-DC converters, electric vehicle systems and many more. Because of Wayon´s capability and expertise as a Mosfet manufacturer more types are already on the roadmap and will be released soon.