» Description
The SoM6 Ti135 is a compact, low-power System-on-Module (SoM) built around the Efinix Titanium Ti135 FPGA, specifically utilizing the high-density N676 FBGA package. Designed for advanced embedded applications that require performance, flexibility, and energy efficiency, the SoM6 Ti135 integrates a rich set of modern features in a form factor that emphasises modularity and interoperability.
» Key Processing and Fabric Features
At the core of the SoM is the Efinix Ti135 FPGA, fabricated on a TSMC 16nm process and featuring the Quantum™ compute fabric.
This fabric includes:
- Up to 129,600 logic elements using eXchangeable Logic and Routing (XLR) cells
- 960 blocks of 10-kbit SRAM (totaling ∼ 9.83 Mbits)
- 480 DSP blocks supporting integer and BFLOAT16 computations
- A quad-core hardened RISC-V processor with full support for RV32IMACFD extensions
This makes the SoM6 Ti135 a strong candidate for edge computing, real-time control, and vision-centric workloads.
» High-Speed Interfaces and Connectivity
The SoM integrates several high-speed interfaces:
- Two full-duplex transceiver banks (not fully routed on the SoM) capable of, 10G Ethernet (10GBase-KR), SGMII, and PMA Direct operation with data rates from 1.25 Gbps to 12.5 Gbps per lane. PCIe Gen 4 is supported at x1 only.
- Dedicated SERDES routing for PCIe and 10G Ethernet
- Extended MIPI D-PHY capabilities supporting up to 2.5 Gbps per lane (TX and RX) via two 30-pin FPC connectors
- A RAW-PMA interface for implementing proprietary high-speed protocols over transceivers
All additional I/O, including power, configuration, and general-purpose signals, are routed through a 240-pin connector (Samtec ADF6–60–03.5–L–4–2–A). This connector is primarily pin-compatible with the AMD Kria K24 SoM, offering a migration path or interoperability for carriers; however, full application-level compatibility cannot be guaranteed due to architectural differences between Efinix’s and AMD’s FPGAs
» Storage and Security
For onboard non-volatile memory, the SoM6 Ti135 includes:
eMMC flash storage (soldered on-module for robustness and space efficiency)
Security is a key focus, with the module integrating the Infineon SLS32AIA010MLUSON10XTMA2 TPM (Trusted Platform Module).
This hardware root-of-trust device supports:
- Secure key storage
- Cryptographic operations
- Platform integrity verification
Standard lead time: 12 weeks
RRP: from 995,00 €
(1.184,05 € VAT included)
For 10 pcs:
RRP: from 595,00 €
(708,05 € VAT included)
For 100 pcs:
RRP: from 350,00 €
(416,50 € VAT included)
Not in stock at the moment!